国家/地区
关键词
出版物
出版时间 2018（2）
机构 HARBIN UNIV SCI TECHNOL（2）
作者 CAI HM（2）

Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

RESULTS IN PHYSICS

LI SL, LIU Y, ZHANG H, CAI HM, SUN FL, ZHANG GQ

Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

JOURNAL OF MATERIALS SCIENCEMATERIALS IN ELECTRONICS

LIU Y, LI SL, ZHANG H, CAI HM, SUN FL, ZHANG GQ