JOURNAL OF ELECTRONIC MATERIALS
LI YK, XU G, HU HQ, CHENG XY, JIANG ZZ
COMPOSITES PART BENGINEERING
WANG R, ZHANG JH, CHEN SY, WU LX, ZHUO DX, CHENG XY
JOURNAL OF APPLIED POLYMER SCIENCE
CHENG XY, ZHANG JM, WANG HP, WU LX, SUN QF
COMPOSITES PART AAPPLIED SCIENCE MANUFACTURING
CHENG XY, YOKOZEKI T, WU LX, WANG HP, ZHANG JM, KOYANAGI J, WENG ZX, SUN QF
COMPOSITES PART AAPPLIED SCIENCE MANUFACTURING
CHENG XY, KUMAR V, YOKOZEKI T, GOTO T, TAKAHASHI T, KOYANAGI J, WU LX, WANG R
JOURNAL OF MATERIALS CHEMISTRY A
WANG R, ZHUO DX, WENG ZX, WU LX, CHENG XY, ZHOU Y, WANG JL, XUAN BW
SOFT MATTER
ZHANG FY, SHA YF, CHENG XY, ZHANG JL
CARBON
ZHOU Y, CHENG XY, HUANG F, SHA Z, HAN ZJ, CHEN JY, YANG WM, YU YY, ZHANG J, PENG SH, WU SY, RIDER A, DAI LM, WANG CH
COMPOSITES PART AAPPLIED SCIENCE MANUFACTURING
SHA Z, CHENG XY, ISLAM MS, SANGKARAT P, CHANG WK, BROWN SA, WU SY, ZHANG J, HAN ZJ, PENG SH, WANG CH
COMPOSITES COMMUNICATIONS
CHENG XY, WANG D, KE HZ, LI YG, CAI YB, WEI QF