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机构 HUAZHONG UNIV SCI TECHNOL（2）
作者 LIU CQ（2）

Microstructural evolution of 96.5Sn-3Ag-0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

JOURNAL OF MATERIALS SCIENCEMATERIALS IN ELECTRONICS

CHEN G, LIU L, SILBERSCHMIDT VV, LIU CQ, WU FS, CHAN YC

Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets

JOURNAL OF ALLOYS COMPOUNDS

CHEN G, WU FS, LIU CQ, SILBERSCHMIDT VV, CHAN YC