IEEE MICROWAVE WIRELESS COMPONENTS LETTERS

WU Z, DU ZL, PENG K, GAN WW, ZHANG XF, LIU G, YANG S, LIU JL, GONG YB, ZENG BQ

ADVANCED FUNCTIONAL MATERIALS

XUE HJ, WU YQ, ZOU YG, SHEN YB, LIU G, LI Q, YIN DM, WANG LM, MING J

INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE

WANG H, WANG JF, LIU G, ZHANG ZK, HOU XP

BMC CHEMISTRY

XU L, WEN YL, PANDIT S, MOKKAPATI VRSS, MIJAKOVIC I, LI Y, DING M, REN SZ, LI W, LIU G

INTERNATIONAL JOURNAL OF AGRICULTURAL BIOLOGICAL ENGINEERING

WANG H, YIN Y, ZHAO G, BIENVENIDO F, FLORESPARRAD IM, WANG ZQ, LIU G

JOURNAL OF ALLOYS COMPOUNDS

QIU SH, LIU G, LI W, ZHAO HC, WANG LP

CHEMISTRYAN ASIAN JOURNAL

WANG Y, LIU G, AN CH, LI L, QIU FY, WANG YJ, JIAO LF, YUAN HT

CHEMISTRYAN ASIAN JOURNAL

QIU FY, LI L, LIU G, XU CC, AN CH, XU YA, WANG Y, HUANG YA, CHEN CC, WANG YJ, JIAO LF, YUAN HT

ELECTROCHIMICA ACTA

LEI M, LIANG C, WANG YJ, HUANG K, YE CX, LIU G, WANG WJ, JIN SF, ZHANG R, FAN DY, YANG HJ, WANG YG

NANO LETTERS

WANG F, LIU G, ROTHWELL S, NEVIUS M, TEJEDA A, TALEBIBRAHIMI A, FELDMAN LC, COHEN PI, CONRAD EH