IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

JAAKKOLA K, SANDBERG H, LAHTI M, ERMOLOV V

PHYSICA STATUS SOLIDIRAPID RESEARCH LETTERS

ARAPOV K, JAAKKOLA K, ERMOLOV V, BEX G, RUBINGH E, HAQUE S, SANDBERG H, ABBEL R, DE WITH G, FRIEDRICH H