国家/地区
关键词 DIELECTRIC BREAKDOWN（2）
出版物
出版时间 2013（2）
机构
作者

A manufacturable process integration approach for graphene devices

SOLIDSTATE ELECTRONICS

VAZIRI S, LUPINA G, PAUSSA A, SMITH AD, HENKEL C, LIPPERT G, DABROWSKI J, MEHR W, OSTLING M, LEMME MC

Quantitatively Enhanced Reliability and Uniformity of High-kappa Dielectrics on Graphene Enabled by Self-Assembled Seeding Layers

NANO LETTERS

SANGWAN VK, JARIWALA D, FILIPPONE SA, KARMEL HJ, JOHNS JE, ALABOSON JMP, MARKS TJ, LAUHON LJ, HERSAM MC