国家/地区 China（3）
关键词 HARDNES（3）
出版物 MODERN PHYSICS LETT.（2）
出版时间 2019（2）
机构 HARBIN UNIV .（3）
作者 SUN FL（3）

Interfacial reaction, microstructure and hardness between graphene-coated Cu substrate and SAC305 solder doped with minor Ni during isothermal aging

MODERN PHYSICS LETTERS B

LI SL, LIU Y, CAI HM, ZHANG H, SUN FL

Effect of Ni concentration on solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu substrates

MODERN PHYSICS LETTERS B

CAI HM, LIU Y, LI SL, ZHANG H, SUN FL, QI JL

Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

RESULTS IN PHYSICS

LI SL, LIU Y, ZHANG H, CAI HM, SUN FL, ZHANG GQ