国家/地区
关键词 INTEGRATED CIRCUIT INTERCONNECTION（2）
出版物
出版时间 2020（2）
机构
作者

A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper- Graphene Hybrid On-Chip Interconnects

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

KUMAR R, KUMAR A, GUGLANI S, KUMAR S, ROY S, KAUSHIK BK, SHARMA R, ACHAR R

Comparative Analysis of the Crosstalk Effects in Multilayer Graphene Nanoribbon and MWCNT Interconnects in Sub-10 nm Technologies

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

HAMEDANI SG, MOAIYERI MH