| 国家/地区 | |
| 关键词 |
INTEGRATED CIRCUIT MODELING(3)
|
| 出版物 | IEEE TRANSACTIONS O.(2) |
| 出版时间 |
2021(3)
|
| 机构 | |
| 作者 |
IEEE MICROWAVE WIRELESS COMPONENTS LETTERS
D AGATI N, ZEC J
IEEE TRANSACTIONS ON ELECTRON DEVICES
JEPPSON K, ASAD M, STAKE J
IEEE TRANSACTIONS ON ELECTRON DEVICES
FAN CY, WEI MD, UZLU B, WANG ZX, NEUMAIER D, NEGRA R
