Diffusion Barrier Prediction of Graphene and Boron Nitride for Copper Interconnects by Deep Learning
IEEE ACCESS
AHMED M, LI Y, CHEN WC, LI EP
BIOSENSORS BIOELECTRONICS
ZHANG HQ, HE RY, NIU Y, HAN F, LI J, ZHANG XW, XU F
MODERN PHYSICS LETTERS B
YAO Q, YANG JJ, LI P, HUANG M
ACS APPLIED MATERIALS INTERFACES
LU Y, ZHOU FL, ZHOU J, KUANG LJ, TAN KT, LU HB, CAI JB, GUO YH, CAO RT, FU YQ, DUAN HG
ADVANCED INTELLIGENT SYSTEMS
HUANG MR, LI ZC, ZHU HW
ACS APPLIED NANO MATERIALS
MENG K, NIU YT, ZHAO XY, ZHANG YN, ZHAO Y, YU XH, RONG J, HOU HY
MATERIALS
QU N, CHEN M, LIAO MQ, CHENG Y, LAI ZH, ZHOU F, ZHU JC, LIU Y, ZHANG L
ACS APPLIED NANO MATERIALS
TAMTAJI M, TYAGI A, YOU CY, GALLIGAN PR, LIU HW, LIU ZJ, KARIMI R, CAI YT, ROXAS AP, WONG HL, LUO ZT
IEEE ELECTRON DEVICE LETTERS
SUN H, TAO LQ, WANG P, REN TL
INFOMAT
SUN H, GAO X, GUO LY, TAO LQ, GUO ZH, SHAO YS, CUI TR, YANG Y, PU X, REN TL