国家/地区 | China(4) India(3) |
关键词 | NUMERICAL MODEL(11) |
出版物 | |
出版时间 | 2022(5) 2021(2) 2023(2) |
机构 | |
作者 | KUMAR R(2) ROY S(2) SHARMA R(2) |
IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY
KUMAR R, KUMAR A, GUGLANI S, KUMAR S, ROY S, KAUSHIK BK, SHARMA R, ACHAR R
SENSORS ACTUATORS BCHEMICAL
DUNST K, JURKOW D, JASINSKI P
NANOMATERIALS
FOLORUNSO O, HAMAM Y, SADIKU R, RAY SS
IEEE PHOTONICS JOURNAL
YU H, SUN LP, JI ST, DENG R, MO ZJ, XIE Q
IEEE SENSORS JOURNAL
CAO PF, LI Y, WU YY, YUAN ZN, LI SL, CHENG L
IEEE TRANSACTIONS ON ANTENNAS PROPAGATION
MEHRDADIAN A, FOROORAGHI K, HOSSEINI K
IEEE JOURNAL OF QUANTUM ELECTRONICS
OUTAFAT A, FACI S, RICHALOT E, PROTAT S, ALGANI C
ADVANCED COMPOSITE MATERIALS
MARRIVADA GV, CHAGANTI PK, SUJITH R, SHARMA B
IEEE TRANSACTIONS ON PLASMA SCIENCE
HE GQ, LI FX, YI ZX, LI ML, YANG XX, STIENS JH
JOURNAL OF THERMAL ANALYSIS CALORIMETRY
GONG JH, SHI LL, ZHAI CJ, PAN Y