国家/地区 India（2）
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A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper- Graphene Hybrid On-Chip Interconnects

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

KUMAR R, KUMAR A, GUGLANI S, KUMAR S, ROY S, KAUSHIK BK, SHARMA R, ACHAR R

A Continuous Electrical Conductivity Model for Monolayer Graphene From Near Intrinsic to Far Extrinsic Region

IEEE TRANSACTIONS ON ELECTRON DEVICES

BHATTACHARYA S, SAHA D, BID A, MAHAPATRA S