国家/地区 Taiwan（2）
关键词 THERMAL CONDUCTIVITY（2）
出版物
出版时间 2018（2）
机构
作者

Ball-milled dispersed network of graphene platelets as thermal interface materials for high-efficiency heat dissipation of electronic devices

JOURNAL OF MICRONANOLITHOGRAPHY MEMS MOEMS

CHANG TC, LIAO CA, LIN ZY, FUH YK

Copper Like Thermal Conductivity and Silicon Like Coefficient of Thermal Expansion Copper Graphene for High Power IGBT by Metal Injection Molding

MATERIALS TRANSACTIONS

MOHAMMADI F, LI SS