国家/地区 China（4）
关键词 THERMAL INTERFACE MATERIAL（5）
出版物 ACS NANO（2）
出版时间 2019（3） 2021（2）
机构 CHINESE ACAD.（3）
作者 WONG CP（5）

Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials

ACS NANO

DAI W, MA TF, YAN QW, GAO JY, TAN X, LV L, HOU H, WEI QP, YU JH, WU JB, YAO YG, DU SY, SUN R, JIANG N, WANG Y, KONG J, WONG CP, MARUYAMA S, LIN CT

Alumina-Coated Cu@Reduced Graphene Oxide Microspheres as Enhanced Antioxidative and Electrically Insulating Fillers for Thermal Interface Materials with High Thermal Conductivity

ACS APPLIED ELECTRONIC MATERIALS

YE HQ, WEN HR, CHEN JH, ZHU PL, YUEN MMF, FU XZ, SUN R, WONG CP

A Paper-Like Inorganic Thermal Interface Material Composed of Hierarchically Structured Graphene/Silicon Carbide Nanorods

ACS NANO

DAI W, LV L, LU JB, HOU H, YAN QW, ALAM FE, LI YF, ZENG XL, YU JH, WEI QP, XU XF, WU JB, JIANG N, DU SY, SUN R, XU JB, WONG CP, LIN CT

Multiscale Structural Modulation of Anisotropic Graphene Framework for Polymer Composites Achieving Highly Efficient Thermal Energy Management

ADVANCED SCIENCE

DAI W, LV L, MA TF, WANG XZ, YING JF, YAN QW, TAN X, GAO JY, XUE C, YU JH, YAO YG, WEI QP, SUN R, WANG Y, LIU TH, CHEN T, XIANG R, JIANG N, XUE QJ, WONG CP, MARUYAMA S, LIN CT

Lightweight thermal interface materials based on hierarchically structured graphene paper with superior through-plane thermal conductivity

CHEMICAL ENGINEERING JOURNAL

GAO JY, YAN QW, LV L, TAN X, YING JF, YANG K, YU JH, DU SY, WEI QP, XIANG R, YAO YG, ZENG XL, SUN R, WONG CP, JIANG N, LIN CT, DAI W