国家/地区
关键词 THERMAL RESISTANCE（2）
出版物 INTERNATIONAL COMMUNICATIONS IN HEAT MASS TRANSFER（2）
出版时间
机构
作者

A 3D numerical study of heat transfer in a single-phase micro-channel heat sink using graphene, aluminum and silicon as substrates

INTERNATIONAL COMMUNICATIONS IN HEAT MASS TRANSFER

SHKARAH AJ, BIN SULAIMAN MY, AYOB MRB, TOGUN H

Reduced graphene oxide films for reducing hotspot temperatures of electronic devices

INTERNATIONAL COMMUNICATIONS IN HEAT MASS TRANSFER

HUANG DJ, PENG WT, LEE YT, LU MC