国家/地区 China（2）
关键词 HIGHTEMPERATURE PRESSURE SENSOR（2）
出版物
出版时间
机构
作者 LI MW（2） WANG JQ（2）

Solid-Liquid Interdiffusion Bonding of Cu-Sn-Cu Interconnection and Sealing for High-Temperature Pressure Sensor Based on Graphene

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

WANG JQ, ZHAO SL, LI MW, WANG PC, LI MH

Hermetic Packaging Based on Cu-Sn and Au-Au Dual Bonding for High-Temperature Graphene Pressure Sensor

MICROMACHINES

WANG JQ, ZHANG HK, CHEN XW, LI MW