国家/地区 India（2）
关键词 NUMERICAL MODEL（2）
出版物
出版时间
机构
作者 ROY S（2）

A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper- Graphene Hybrid On-Chip Interconnects

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

KUMAR R, KUMAR A, GUGLANI S, KUMAR S, ROY S, KAUSHIK BK, SHARMA R, ACHAR R

Comparative Analysis of Prior Knowledge-Based Machine Learning Metamodels for Modeling Hybrid Copper-Graphene On-Chip Interconnects

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

KUSHWAHA S, SOLEIMANI N, TREVISO F, KUMAR R, TRINCHERO R, CANAVERO FG, ROY S, SHARMA R