国家/地区 India（3）
关键词 NUMERICAL MODEL（3）
出版物
出版时间
机构
作者 KUMAR R（2） ROY S（2） SHARMA R（2）

A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper- Graphene Hybrid On-Chip Interconnects

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

KUMAR R, KUMAR A, GUGLANI S, KUMAR S, ROY S, KAUSHIK BK, SHARMA R, ACHAR R

Effect of addition of graphene nanoplatelets on the mechanical properties of triaxially braided composites

ADVANCED COMPOSITE MATERIALS

MARRIVADA GV, CHAGANTI PK, SUJITH R, SHARMA B

Comparative Analysis of Prior Knowledge-Based Machine Learning Metamodels for Modeling Hybrid Copper-Graphene On-Chip Interconnects

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

KUSHWAHA S, SOLEIMANI N, TREVISO F, KUMAR R, TRINCHERO R, CANAVERO FG, ROY S, SHARMA R