国家/地区 Taiwan（3）
关键词
出版物 APPLIED PHYSICS LETTERS（3）
出版时间 2015（3）
机构
作者

Hybrid stacking structure of electroplated copper onto graphene for future interconnect applications

APPLIED PHYSICS LETTERS

SU YW, WU CS, LIU CH, LIN HY, CHEN CD

Non-vacuum growth of graphene films using solid carbon source

APPLIED PHYSICS LETTERS

NGUYEN BS, LIN JF, PERNG DC

Graphene-like conjugated pi bond system in Pb1-xSnxSe

APPLIED PHYSICS LETTERS

SHU GJ, LIOU SC, KARNA S, SANKAR R, HAYASHI M, CHU MW, CHOU FC