国家/地区 Usa（3）
关键词 EPOXY NANOCOMPOSITE（2） SEMICONDUCTOR PACKA.（2）
出版物
出版时间 2022（3）
机构
作者 LIU YF（3）

Crumpled graphene epoxy nanocomposites modified with polydopamine for advanced semiconductor packaging applications

COMPOSITES SCIENCE TECHNOLOGY

SUN ZJ, LIU YF, WONG RY, YU M, LI JX, MORAN M, KATHAPERUMAL M, WONG CP

Melamine-graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications

NANOSCALE

SUN ZJ, WONG R, LIU YF, YU M, LI JX, SPENCE D, ZHANG MY, KATHAPERUMAL M, WONG CP

Polydopamine-modified graphene with cellulose nanofibers to act as fillers in epoxy nanocomposites for application in the next generation of green electronic packaging materials

CHEMICAL ENGINEERING JOURNAL

SUN ZJ, LIU YF, WONG RY, YU MC, LI JX, MORAN M, ZHANG MY, DAHARIYA S, WONG CP