国家/地区 Usa（6）
关键词 EPOXY NANOCOMPOSITE（3） POLYDOPAMINEGRAPHEN.（2） SEMICONDUCTOR PACKA.（2）
出版物 CHEMICAL ENGINEERIN.（2）
出版时间 2022（6）
机构
作者 WONG CP（6）

Crumpled graphene epoxy nanocomposites modified with polydopamine for advanced semiconductor packaging applications

COMPOSITES SCIENCE TECHNOLOGY

SUN ZJ, LIU YF, WONG RY, YU M, LI JX, MORAN M, KATHAPERUMAL M, WONG CP

Melamine-graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications

NANOSCALE

SUN ZJ, WONG R, LIU YF, YU M, LI JX, SPENCE D, ZHANG MY, KATHAPERUMAL M, WONG CP

One-Step Ultraviolet Laser-Induced Fluorine-Doped Graphene Achieving Superhydrophobic Properties and Its Application in Deicing

ACS APPLIED MATERIALS INTERFACES

CHEN Y, LONG JY, XIE B, KUANG YC, CHEN X, HOU MX, GAO J, LIU HL, HE YB, WONG CP

Polydopamine-modified graphene with cellulose nanofibers to act as fillers in epoxy nanocomposites for application in the next generation of green electronic packaging materials

CHEMICAL ENGINEERING JOURNAL

SUN ZJ, LIU YF, WONG RY, YU MC, LI JX, MORAN M, ZHANG MY, DAHARIYA S, WONG CP

Ambient-air in situ fabrication of high-surface-area, superhydrophilic, and microporous few-layer activated graphene films by ultrafast ultraviolet laser for enhanced energy storage

NANO ENERGY

LIU HL, ZHENG YX, MOON KS, CHEN Y, SHI DC, CHEN X, WONG CP

Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for Polydopamine-Graphene fillers in epoxy polymers

CHEMICAL ENGINEERING JOURNAL

SUN ZJ, WONG R, YU M, LI JX, ZHANG MY, MELE L, HAH J, KATHAPERUMAL M, WONG CP