国家/地区 China（2）
关键词 FILLER（2）
出版物
出版时间 2019（2）
机构 CHINESE ACAD SCI（2）
作者 SUN R（2）

Three-dimensional interconnected graphene microsphere as fillers for enhancing thermal conductivity of polymer

CHEMICAL ENGINEERING JOURNAL

LI C, ZENG XL, TAN LY, YAO YM, ZHU DL, SUN R, XU JB, WONG CP

Alumina-Coated Cu@Reduced Graphene Oxide Microspheres as Enhanced Antioxidative and Electrically Insulating Fillers for Thermal Interface Materials with High Thermal Conductivity

ACS APPLIED ELECTRONIC MATERIALS

YE HQ, WEN HR, CHEN JH, ZHU PL, YUEN MMF, FU XZ, SUN R, WONG CP