国家/地区 | |
关键词 | INTEGRATED CIRCUIT MODELING(3) |
出版物 | IEEE TRANSACTIONS O.(2) |
出版时间 | 2021(3) |
机构 | |
作者 |
IEEE MICROWAVE WIRELESS COMPONENTS LETTERS
D AGATI N, ZEC J
IEEE TRANSACTIONS ON ELECTRON DEVICES
JEPPSON K, ASAD M, STAKE J
IEEE TRANSACTIONS ON ELECTRON DEVICES
FAN CY, WEI MD, UZLU B, WANG ZX, NEUMAIER D, NEGRA R