国家/地区 Usa（2）
关键词 SEMICONDUCTOR PACKAGING（2）
出版物
出版时间 2022（2）
机构
作者 LI JX（2）

Crumpled graphene epoxy nanocomposites modified with polydopamine for advanced semiconductor packaging applications

COMPOSITES SCIENCE TECHNOLOGY

SUN ZJ, LIU YF, WONG RY, YU M, LI JX, MORAN M, KATHAPERUMAL M, WONG CP

Polydopamine-modified graphene with cellulose nanofibers to act as fillers in epoxy nanocomposites for application in the next generation of green electronic packaging materials

CHEMICAL ENGINEERING JOURNAL

SUN ZJ, LIU YF, WONG RY, YU MC, LI JX, MORAN M, ZHANG MY, DAHARIYA S, WONG CP