国家/地区 China（5） Usa（4）
关键词 EPOXY NANOCOMPOSITE（3） POLYDOPAMINEGRAPHEN.（2） SEMICONDUCTOR PACKA.（2）
THERMAL PROPERTIE（2）
出版物 CHEMICAL ENGINEERIN.（2） COMPOSITES PART AAP.（2） COMPOSITES SCIENCE .（2）
出版时间 2022（9）
机构
作者 SUN ZJ（9）

Crumpled graphene epoxy nanocomposites modified with polydopamine for advanced semiconductor packaging applications

COMPOSITES SCIENCE TECHNOLOGY

SUN ZJ, LIU YF, WONG RY, YU M, LI JX, MORAN M, KATHAPERUMAL M, WONG CP

Melamine-graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications

NANOSCALE

SUN ZJ, WONG R, LIU YF, YU M, LI JX, SPENCE D, ZHANG MY, KATHAPERUMAL M, WONG CP

Oligo-layer graphene stabilized fully exposed Fe-sites for ultra-sensitivity electrochemical detection of dopamine

BIOSENSORS BIOELECTRONICS

SUN ZJ, SUN S, JIANG X, AI YJ, XU WJ, XIE LP, SUN HB, LIANG QL

Flexible and environmentally friendly graphene natural rubber composites with high thermal conductivity for thermal management

COMPOSITES PART AAPPLIED SCIENCE MANUFACTURING

DUAN XY, CHENG SS, LI ZW, LIANG CB, ZHANG ZY, ZHAO GZ, LIU YQ, AN D, SUN ZJ, WONG CP

Ultrasensitive and wide-range reduced graphene oxide/natural rubber foam sensors for multifunctional self-powered wireless wearable applications

COMPOSITES SCIENCE TECHNOLOGY

ZHANG YJ, WANG ZH, YU P, YANG XJ, SUN ZJ, ZHANG YF, WU YG, JIANG C

Modulation of covalent bonded boron nitride/graphene and three-dimensional networks to achieve highly thermal conductivity for polymer-based thermal interfacial materials

COMPOSITES PART AAPPLIED SCIENCE MANUFACTURING

AN D, LI ZW, CHEN HF, LIANG CB, SUN ZJ, LI JX, YAO JR, LIU YQ, WONG CP

Facile fabrication of a spindle-like CuO anchored on Graphene nanocomposite with relative high-rate performance and cycle stability for flexible supercapacitor

JOURNAL OF MATERIALS SCIENCEMATERIALS IN ELECTRONICS

ZHANG JJ, WANG HY, WANG QZ, SUN ZJ, BUHE B, SUN YT, MENG CH

Polydopamine-modified graphene with cellulose nanofibers to act as fillers in epoxy nanocomposites for application in the next generation of green electronic packaging materials

CHEMICAL ENGINEERING JOURNAL

SUN ZJ, LIU YF, WONG RY, YU MC, LI JX, MORAN M, ZHANG MY, DAHARIYA S, WONG CP

Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for Polydopamine-Graphene fillers in epoxy polymers

CHEMICAL ENGINEERING JOURNAL

SUN ZJ, WONG R, YU M, LI JX, ZHANG MY, MELE L, HAH J, KATHAPERUMAL M, WONG CP