国家/地区 China（2）
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出版物 IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY（2）
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Solid-Liquid Interdiffusion Bonding of Cu-Sn-Cu Interconnection and Sealing for High-Temperature Pressure Sensor Based on Graphene

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

WANG JQ, ZHAO SL, LI MW, WANG PC, LI MH

Varactor-Graphene-Based Bandpass Filter With Independently Tunable Characteristics of Frequency and Amplitude

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

HOU R, CHEN JZ, ZHAO YT, SU T, LI L, XU KD