国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7） C09（2） H05（2）
IPC小类 C08J（7）
IPC C08J005/18（3） C08K003/04（3） C08L027/16（2）
C08L077/02（2） C08L089/00（2）
发明人 ZHANG C（7）
公开年 2021（7）
申请年 2021（7）
专利权人 HARBIN INST .（2）

Flexible electromagnetic shielding material useful in wearable health monitoring, electronic skin, portable smart electronic and outdoor equipment, comprises flexible substrate and electromagnetic shielding material dispersed in the flexible substrate.

LI K, ZHANG C, YIN R, ZHAO W

Functionalized aqueous polyurethane material for electronic packaging materials, is prepared of polyester polyol, diisocyanate, hydrophilic chain extender, catalyst, diethylene glycol terephthalate, graphene oxide, internal crosslinking agent, organic solvent, diluent, neutralizing agent and water.

SHEN Y, LIANG X, ZHANG C, LI Q, HE H

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Low temperature molded laser transfer coating useful in chemical industry, comprises e.g. sepiolite, activated carbon powder, orange peel essential oil, surfactant, antifoaming agent, inorganic salt, acrylic resin, and auxiliary agent.

XIANG S, DU C, ZHANG C, SUN Y

Preparing thin film involves preparing dispersion liquid containing nano-carbon material and sericin, adding degradable biomass material into dispersion.

ZHAO W, YIN R, ZHANG C

Preparing high-performance three dimensional printed piezoelectric piece, comprises preparing polymer and ceramic materials into polymer/ceramic piezoelectric composite powder, coating and performing selective laser sintering.

CHEN N, CHEN F, WANG Q, LI Y, ZHANG C, ZHANG X

Micro-foamed polyamide magnetic plastic used for e.g. automotive application, comprises polyamide resin, carbon dioxide affinity additive, phenolic hydroxyl resin, filler, compatibilizer, nucleating agent, and foaming agent.

LI S, JIANG T, ZHU N, ZENG X, SHEN C, HE L, GONG W, ZHANG C