国家/地区 美国（2）
IPC部 B（2） C（2）
IPC大类 B82（2）
IPC小类 B82Y（2）
IPC B82Y030/00（2）
发明人
公开年
申请年
专利权人

Coating used for protecting component exposed to corrosive environment, comprises epoxy phenolic resin, and graphene nanoplatelets.

POTEET S, FOLSOM M E, KAPALCZYNSKI K, FURSOAME M E

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S