国家/地区 中国（2）
IPC部 B（2）
IPC大类 B29（2）
IPC小类 B29D（2）
IPC
发明人
公开年 2022（2）
申请年
专利权人

Mold used for molding component, comprises mixture of polymer material and filling material suitable for heating component within mold by electromagnetic field.

SILTAMAEKI J, GOTHE B, WEIGER H, SEEFRIED A J, DREXLER M, PRICE D S, SCHNEIDER K, DRUMMER D K, HIFRELID A, SEEFRIED A, SILTAMAKI J, GOETHE B, WIEGER H

Polymeric sandwich structure comprises two layers formed from polymer matrix including fiber reinforcing sheet, and third layer formed from third polymer matrix having graphene nanoplatelets.

HUANG X, ZHAO S X