国家/地区 台湾（2）
IPC部 B（2）
IPC大类 B32（2） C08（2）
IPC小类 B32B（2）
IPC C08K013/02（2）
发明人
公开年
申请年 2020（2）
专利权人

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S