国家/地区 欧洲专利局（EPO）（2） 美国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC C09D005/00（2）
发明人 PUJAR V V（2）
公开年 2021（2）
申请年
专利权人

Forming adhesively bonded structure used as building infrastructures, by applying primer compound comprising functionalized nanomaterial dopant to substrate, drying primer compound on substrate, applying adhesive compound over primer layer, contacting adhesive layer with substrate, and curing.

SMITH B A, POTEET S A, PUJAR V V

Corrosion inhibition on substrate, involves applying sealing solution comprising nanomaterial dopant to anodized surface of substrate, and drying sealing solution on substrate to form sealing layer comprising corrosion inhibiting compound.

STEELE L, PUJAR V V, SMITH B A, POTEET S A