国家/地区 中国（2）
IPC部 C（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C01B032/184（2）
发明人
公开年
申请年 2019（2）
专利权人

Preparing three-dimensional structure carbon nanotube and graphene composite CPU heat dissipation material comprises equipping with ice bath, mixing concentrated sulfuric acid, activated carbon powder, dispersing, spraying and treating.

ZHANG J

Graphene heat-conducting film used for mobile phones or flat plates comprises graphene heat-conducting film component, double-sided adhesive layer and heat-conducting silica gel sheet.

INVENTOR U