国家/地区 中国（9）
IPC部 E（9）
IPC大类 E04（9） F24（9） H05（4）
IPC小类 E04F（9）
IPC E04F015/02（9）
发明人 GAN J（3）
公开年 2017（9）
申请年 2017（7）  2016（2） 
专利权人 SICHUAN HONG.（2）

Graphene floor heating tile for building, has two silver paste electrodes which are arranged on surface of supporting film and conductive ink connected between two silver paste electrodes.

CHEN M, GONG Y, LU W, YANG Y

Graphene heating ceramic tile, has heating resistance wire arranged in heating resistance wire groove, and heat-conducting bridge fixed with two ends of heating resistance wire and conducting pier bridge composite graphene.

GAN J

Graphene composite far infrared floor heating brick for floor heating device, has nine-layer structure provided with ceramic tile layer, and flame-retardant insulating layer, and composite graphite heating film layer is connected with wire.

LI Y

Graphene composite material brick, has electric heating layer formed with composite material, and insulating layer formed with perlite material, where graphite, silver and alumina are contained in material of electric heating layer.

GAN J

Carbon nanotube graphene warm thin tiles, comprises heating layer comprising carbon nanotube, graphene, ammonium carbonate, and ferric chloride, where heating layer is electric heating layer.

GAN J

Graphene composite material far infrared negative ion-core electric heating floor comprises e.g. decorative surface, solid wood composite board and graphite nano far infrared negative ion composite fiber heat-conducting film.

SHI W

Intelligent graphene silica gel carbon fiber heating floor, has bottom plate comprising graphene silica gel carbon fiber wire that is connected to copper wire joint through terminal machine, where fiber wire is fixed in u-shaped groove.

YAO J

Graphene carbon nano-tube stainless steel alloy heating plate, has heating plate provided with upper protective layer, heat insulating layer and lower protecting layer, where thickness of lower protective layer is in specific range.

FANG J

Heat-generating tile with chip, has outer heating layer that is connected with two connecting wires, and heating layer that is provided with multiple graphene chips, and graphene chip that is equipped with several regular holes.

DONG R, HE L, YOU T