国家/地区 中国（8）
IPC部 F（8）
IPC大类 F24（8）
IPC小类 F24D（8）
IPC F24D013/02（7） E04F015/02（2） E04F015/10（2）
E04F015/18（2）
发明人 LIU C（8）
公开年 2023（3） 2021（2） 2022（2）
申请年 2022（4）  2020（2） 
专利权人 DONGGUAN WEI.（2） JIANGXI HEME.（2） JIANGXI WEIM.（2）

Assembled type graphene heating wallboard, has reflecting film layer whose side far away from extruded sheet layer is provided with graphene electric heating film layer.

LIU C, QING C, XU L

Wall-warming gypsum composite board, has connecting sheet connected with edge of storage cavity to integrally fix graphene heating sheet at opening of cavity, where board is formed by injecting heat-conducting filling foam into cavity.

QIU K, WANG H, LU X, LIU C, LIU W, GUO C

Graphene electric floor heating with anti-static structure, has insulating antistatic layer whose inner portion is movably mounted with graphene floor heating layer.

LIU C

Graphene heating furnace, has graphene coating and electrode lead that are glued by graphite conductive adhesive and U-shaped pipe is fixedly connected on shell by fastener.

LIU C, HUANG Z, WANG Y

Heating ceramic tile, has adhesive layer arranged on heating module, ceramic tile main body formed on adhesive layer and bonded to heating module through adhesive layer, and exhaust channel reserved between ceramic tile body and heating module.

SHI J, LIU C, WANG Y, LIN C, LONG Y, LIN K, YU H

Silica gel heating floor heating brick, has surface layer, heating core layer and bottom layer orderly arranged from top to bottom, where heating core layer is attached to upper end surface of bottom layer and bottom layer is sleeved in surface layer.

LIU C

Heating ceramic tile comprises ceramic tile matrix layer, graphene heating layer, inorganic insulating layer and non-glazed ceramic tile layer arranged in turn from top to bottom.

HUANG J, LIN K, YU H, WANG Y, GU Z, LIU R, LONG Y, LIU C

Graphene composite smart health floor heating device, has insulating plate whose upper surface is paved with reflecting layer, and temperature controller electrically connected with heating layer through lead.

XIE K, GUO H, MA X, LIU C, ZHU L, PAN D