国家/地区 世界知识产权组织（5）
IPC部 B（5） C（4） A（2）
IPC大类 B29（5）
IPC小类 B29C（5） B33Y（5） C08J（2）
C09D（2）
IPC B33Y010/00（3） B29C064/00（2） B29C064/153（2）
B33Y080/00（2）
发明人
公开年 2023（5）
申请年 2022（5）
专利权人

Treating molded component used for product, involves bringing molded component into contact with workpiece by introducing area of workpiece into molded component, extending out of surface of molded component and contacting molded component with solvent.

FOLGER A, ROSENFELD A

Two-photon polymerization compatible photosensitive ink or resin used in fabricated device including micro/nanoelectronic, battery, optic element, flexible electronic device, printed circuit board, and chip-scale electronic, comprises organic semiconductor, crosslinker, photoinitiator, and solvent.

ABIDIAN M R, DADRASTOUSSI O, KHORRAMI M, MAJD S

Method for forming three-dimensional structure using droplet-based freeform printing, involves depositing structural material through nozzles onto surface of substrate, and solidifying matrix material to form matrix.

GARG A, OZDOGANLAR O B, LEDUC P R, YERNENI S S

Sinterable polymer composition used in powder, comprises random copolymer of propylene and olefinic comonomer, clarifier and nucleator, and antioxidants, acid scavenger, peroxide, enhanced infrared energy absorber, long-term heat agent, and polyolefin elastomer.

SING M K, MOHAMMADI H, WERLANG M M, DE AZEREDO A P, FALLON J, HERRINGTON K, AZINGER C

Particulate composition used in printed object, contains powder particulates of thermoplastic polymer and piezoelectric particles which are located in polymer at outer surface of powder particulates and/or within core of powder particulates.

VELLA S J, VASILEIOU A, ZHU Y, ZWARTZ E G