国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08G（2）
IPC C08G018/48（2）
发明人
公开年 2023（2）
申请年 2023（2）
专利权人

High-barrier heat-resistant solvent-free polyurethane composite material useful as film lamination in packaging composite field of e.g. daily chemical, comprises e.g. polyurethane prepolymer, graphene modified polyol, polyester polyol, nano-silicon dioxide modified polyether polyol and isocyanate.

HE C, TIAN L, WEN Y

Carbon dioxide-based bi-component polyurethane thermal-conducting adhesive comprises isocyanate terminated double ended polyurethane prepolymer, spherical alumina as thermally conductive filler, polyether polyol, polybutadiene polyol and small molecule polyol.

CAO Y, LIU T, LIN H, ZHANG X