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Thermoelectric material for thermoelectric device and thermoelectric module comprises thermoelectric composite structure containing a set of pores, and graphene disposed between the set of pores and doped with a non-metallic element.
LEE H J, KIM S H, KIM Y M, BARK H W
Preparing polyimide film used as high heat dissipation material, involves taking molar ratio of dianhydride and diamine, adding aromatic dianhydride to obtain polyamide, adding nano-graphene, adding imidization dehydrating agent, catalyst.
CHEN Z, YAGN L, SHI E
Metal alloy-doped graphene thin film material contains graphene, nickel alloy, magnesium alloy, aluminum alloy, polyimide, polysulfone, glass fiber, vinyl methyl ether, melamine phosphate, dispersant, coupling agent and thermal stabilizer.
ZHANG W
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