国家/地区 中国（6）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08J（6）
IPC C08J005/18（4） C08K003/04（4） C08L079/08（4）
C08G073/10（2） C08J007/04（2） C09D007/62（2）
C09D179/08（2）
发明人 HAN Y（2） JIN L（2） MA Y（2）
ZHOU H（2）
公开年 2021（2） 2022（2）
申请年 2022（2） 
专利权人 UNIV HARBIN SCI TECHNOLOGY（6）

Sandwich type graphene oxide/polyimide porous composite film used as encapsulation material, comprises layer of fluorine-free polyimide flat film and graphene oxide/fluorine-containing polyimide porous films attached to upper surface and lower surface of layer of flat film.

HAN Y, MA Y

Graphene oxide/polyimide porous composite film useful as insulating material, comprises fluorine-free polyimide flat film substrate, and fluorine-containing polyimide oxide porous film attached to flat film substrate.

HAN Y, MA Y

Selective composite film formed by crushing, mixing and hot-pressing a barium titanate/polyvinylidene fluoridecomposite material and a grapheme/polystyrene composite material.

WANG Y, WANG C, HAN Z, ZHANG M, WANG J

Preparing graphene-polydopamine-silver core-shell nanoparticle useful for preparing polymer composite film, comprises e.g. dissolving polyvinylpyrrolidone in silver ammonia solution, adding graphene-polydopamine nanoparticle and reacting.

WENG L, ZHU P, GUAN L, ZHANG X, LIU L

Preparing phenyl silsesquioxane/graphene oxide/polyimide three-phase composite film comprises e.g. dissolving expanded graphite with mixed acid solution, adding potassium permanganate, centrifuging, grinding and ultrasonically vibrating.

ZHOU H, WANG X, ZHANG H, JIN L

Producing silica hollow sphere/graphene oxide/polyimide composite film for printed circuit board, involves carrying out template method to obtain core-shell structure of microspheres, and sintering to obtain nano-silica hollow spheres.

JIN L, YANG Y, ZHOU H