国家/地区 美国（2）
IPC部 B（2）
IPC大类 B29（2） C08（2）
IPC小类 B29C（2）
IPC C08J005/00（2）
发明人
公开年
申请年
专利权人

Mold used for molding component, comprises mixture of polymer material and filling material suitable for heating component within mold by electromagnetic field.

SILTAMAEKI J, GOTHE B, WEIGER H, SEEFRIED A J, DREXLER M, PRICE D S, SCHNEIDER K, DRUMMER D K, HIFRELID A, SEEFRIED A, SILTAMAKI J, GOETHE B, WIEGER H

Manufacturing product for e.g., electronic device, by combining first polymerizable component and second polymerizable component to form composition and polymerizing polymerizable component to form polymer structure with at least two phases.

SAMPSON K, DEORE B, PAQUET C, LACELLE T, MALENFANT P R L