国家/地区 中国（2）
IPC部 C（2）
IPC大类 C04（2）
IPC小类 C04B（2）
IPC C04B026/04（2）
发明人
公开年 2018（2）
申请年 2017（2）
专利权人

Graphene-based heat conducting composite material useful for heat dissipation of electronic product, comprises graphene, palladium or platinum, copper nanoparticles and resin polymer.

LI X, SHI M

Heat insulating material comprises cement-based block skeleton comprising cavities filled with graphene-modified polystyrene formed by melt-extruding graphene and polystyrene in presence of alkali foaming agent.

TONG S