国家/地区 美国（2）
IPC部 C（2）
IPC大类 C08（2） C09（2）
IPC小类 C08J（2）
IPC C08J005/18（2）
发明人
公开年 2023（2）
申请年
专利权人

Thermally conductive material comprises base polymer, ethylene methyl acetate, graphite fibers and bis(2-ethylhexyl) adipate.

PARE R, KAMAVARAM V

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z