国家/地区 中国（2） 世界知识产权组织（2）
IPC部 B（2）
IPC大类 C08（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年
申请年
专利权人

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Depositing graphene onto a substrate used in polymeric composites, involves transferring solubilized graphene onto the substrate in a liquid medium, where transferring occurs by changing the solubility of graphene in the liquid medium.

PAWLOSKI A R, BENNETT G S, CERNOHOUS J J, KASKE K, SZYMANSKI A E