国家/地区 美国（11）
IPC部 C（11）
IPC大类 C25（11） C01（8） H01（4）
B82（3） B01（2） C09（2）
C23（2） F28（2） H05（2）
IPC小类 C25D（11）
IPC C25D003/38（11）
发明人 JO T（2） JO T J（2） KIDEOK S（2）
LEE S（2） LEE S H（2） PARK S（2）
SEULKI P（2） SONG K（2） SONG K D（2）
SUNHYOUNG L（2） TAE J J（2）
公开年 2017（3） 2021（2）
申请年 2017（3）  2021（3）  2013（2）  2018（2） 
专利权人 ILJIN MATERI.（2）

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F

Producing composite material used for e.g., electrocatalysis by impregnating a two-dimensional (2D)-material based aerogel with impregnation solvent, performing a solvent/water exchange, performing precursor diffusion and passing a current.

YANG W, MOISSINAC F, BARG S, BYUN J J, FRANCIS M, BARGZUELEN, GRADE S

Forming electroplated copper on surface of non-metal materials by graphene-based plating ink involves preparing graphene-based plating ink, spraying plating ink on surface of non-metal material and drying ink sprayed on surface.

KU K, CHANG K, LAI C

Producing metal matrix nanocomposite by preparing graphene dispersion, bringing the graphene dispersion in physical contact with solid substrate surface, and depositing layer of metal or metal alloy onto surfaces of aligned graphene sheets.

ZHAMU A, LIN Y, JANG B Z

Electrolytic copper foil used for producing graphene, has preset ratio of surface roughness of copper foil and surface roughness of copper foil after heat treatment.

JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K

Electrolytic copper foil used for forming graphene during fabrication of semiconductor component for computer, electronic paper and display, has preset tensile strength before and after subjecting to heat-treatment.

JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K

Production of graphene film used in nanoelectronics, involves forming catalyst film on conductive support, forming graphene film on catalyst film, and electrolytically removing catalyst film from support.

BOTTE G G

Formation of complex plating film used in electronic material, involves adding graphene-coated metal powder to plating solution, and forming plating film by performing electric plating in solution to which metal powder is added.

SUH S, SONG Y, PARK J, KIM T, SON H, SHIN J, LEE M, LEE J, LEE C, CHO Y, BAEG S, AHN B, YUN S

Producing graphene layer from liquid metal matrix on solid metal or ceramic substrate of multilayered plate containing e.g. graphene forming matrix, comprises heating, annealing and supplying acetylene, ethylene and hydrogen and cooling.

MODRZYK W, KULA P, RZEPKOWSKI A, PIETRASIK R, ATRASZKIEWICZ R, DYBOWSKI K