国家/地区 中国（6）
IPC部 C（7）
IPC大类 C25（7） C23（3）
IPC小类 C25D（7）
IPC C25D005/34（7）
发明人 CHEN M（2） CHEN Y（2）
公开年 2020（5）
申请年 2019（7）
专利权人 UNIV BINZHOU（2）

Conductive slurry for plating circuit board, comprises carbon material containing carbon nanotube and/or graphene, dispersant and binder, which are uniformly mixed in solvent.

CHIU C, HUANG C

Preparing sulfonated modified graphene oxide-based superhydrophobic copper-nickel alloy surface comprises e.g. first polishing copper nickel alloy through sand paper to removing impurities and oxides on surface and ultrasonically cleaning.

CHEN Y

Preparing graphene-based superhydrophobic B30 copper-nickel alloy involves polishing B30 copper-nickel alloy with sandpaper to remove impurities and oxides on the surface, using absolute ethanol and ultrasonic cleaning.

LIU Y, CHEN Y

Roller plating bronze and hydroxyl graphene closed plating layer structure comprises metal substrate, copper plating layer, bronze plating layer, and bronze plating layer sequentially prepared from inside to outside on metal substrate.

GUO C, CHEN M, LAI H

Vacuum brazing dispersed copper involves cleaning surface of dispersed copper workpiece, drying, blasting using graphene composite particles, placing in rare gas atmosphere, irradiating, cooling, electroplating, and vacuum brazing.

YANG P, CHEN M, HOU R, WANG X

Preparing graphene film on metal surface comprises preparing basic plating liquid, pre-processing the base material, electrochemically deposited M-C coating layer, and annealing.

TAN J, ZHANG Q, TANG Z, CHEN Q, LIU X, XIE F, ZANG Y, MENG L, XU Y, CAI Z

Graphene-containing PCB copper composite plating solution includes a copper ion source, where the copper ion source is preferably copper chloride, copper sulfate, the content of the copper ion source is 55-95g/L, sulfuric acid is preferred.

LI A