国家/地区 中国（3）
IPC部 C（3）
IPC大类 C22（3）
IPC小类 C25D（3）
IPC C22C001/10（2） C25D003/38（2） C25D005/54（2）
发明人 HU X（2）
公开年 2018（2）
申请年 2018（3）
专利权人

Preparation of composite heat dissipation material used in e.g. computers, involves dispersing copper and graphene powder and carbon nanotubes into absolute ethanol solution, depositing, annealing, and cooling.

HU X

Preparation of high strength and high conductivity copper-based composite material comprises taking oxidized graphene aqueous solution, adding hydroiodic acid, reacting, plating, and hot press molding under protection of argon gas.

HU X, HU Y, MA X, YU J, CENG H, WEN Y

Preparing thin-wall aluminium alloy involves taking copper, manganese, magnesium, zinc, chromium, titanium, silicon, iron, 5-8 graphene and balanced amount of water, immersing graphene in liquid furan resin, and then taking out and drying.

XIE Z, LI K