国家/地区 中国（5）
IPC部 C（5）
IPC大类 C25（5） C09（2）
IPC小类 C25D（5）
IPC C25D003/38（3） C25D005/48（3） C09D007/61（2）
C25D003/40（2） C25D003/56（2） C25D005/34（2）
发明人 CHEN M（5）
公开年 2020（5）
申请年 2019（5）
专利权人 GUANGZHOU UL.（4）

Plating layer structure for sealing red copper and nano graphene, comprises metal substrate, cyanide pre-plating copper layer, middle copper plating layer, bright copper plating layer, gun black tin nickel alloy plating layer and graphene sealing layer.

GUO C, CHEN M, LAI H

Bronze and nano graphene plating layer structure comprises metal substrate, cyanide pre-plating copper layer, middle copper plating layer, bright copper plating layer, bronze plating layer, black tin nickel alloy plating layer and graphene sealing layer.

GUO C, CHEN M, LAI H

Roller plating bronze and hydroxyl graphene closed plating layer structure comprises metal substrate, copper plating layer, bronze plating layer, and bronze plating layer sequentially prepared from inside to outside on metal substrate.

GUO C, CHEN M, LAI H

Plating layer structure for rolling plating antique copper comprises metal substrate, copper plating layer, antique copper coloring layer and graphene sealing layer orderly prepared from inside to outside on metal substrate.

GUO C, CHEN M, LAI H

Vacuum brazing dispersed copper involves cleaning surface of dispersed copper workpiece, drying, blasting using graphene composite particles, placing in rare gas atmosphere, irradiating, cooling, electroplating, and vacuum brazing.

YANG P, CHEN M, HOU R, WANG X