国家/地区 中国（3）
IPC部 F（3）
IPC大类 F24（3）
IPC小类 F24D（3）
IPC F24D013/02（3） F24D019/10（2）
发明人 ZHANG W（3）
公开年 2021（3）
申请年 2020（2） 
专利权人 YUNCHENG MEI.（2）

Graphene heating floor for disassembling and maintaining, has front and back two ends of floor main portion are provided with pipe inlet and bottom of inner wall of inner placing groove is provided with pipeline groove.

ZHANG W

Graphene heating panel in which control surface is connected to graphene heating chip through wire, and graphene heating chip is arranged inside plate that is provided with fixing frame for fixing, and graphene heating chip is arranged on bottom layer.

ZHANG W

Graphene floor heating film, has graphene heating layer whose upper and lower surfaces are respectively provided with upper and lower packaging layers, where lower surface of lower packaging layer is provided with lower protective layer.

ZHANG W, YIN H, DENG K