国家/地区 中国（8）
IPC部 B（8）
IPC大类 B22（8）
IPC小类 B22F（8）
IPC B22F009/24（8）
发明人 LIU Y（7）
公开年 2016（8）
申请年 2015（8） 
专利权人 LIU Y（7）

Composite structure of graphene and carbon nanotube configured in a three-dimensional form used in electrodes, comprises graphene platelets, metal particles coated on graphene platelets, and carbon nanotubes formed on metal particles.

WU M Y, HSIEH C, PENG C, WU Y, XIE C, HSIEH C Y, PENG C S

Manufacture of graphene-nano nickel thermoelectric thin film involves washing copper substrate with acetone, deionized water and methanol, placing substrate in container including uniform graphene solution, and performing electrophoresis.

LIU Y

Manufacture of graphene-supported nano-nickel thermoelectric composite film involves mixing sulfonated graphite, triblock copolymer and ammonium acetate, adding nickel chloride, heating, forming membrane and performing electrophoresis.

LIU Y

Preparation of graphene-nano nickel thermoelectric thin film involves preparing wave-absorbing material from oxidized graphite, adding deionized water, and performing electrodeposition on copper substrate using obtained solution.

LIU Y

Preparation of graphene-loaded nano-nickel thermoelectric composite thin film involves preparing wave-absorbing material from oxidized graphite, adding to deionized water and electrodepositing obtained solution on copper substrate.

LIU Y

Preparation of graphene-loaded nano-nickel thermoelectric composite thin film involves preparing wave-absorbing material from oxidized graphite, adding to deionized water and electrodepositing obtained solution on copper substrate.

LIU Y

Preparation of graphene-loaded nano-nickel thermoelectric composite thin film involves preparing wave-absorbing material from oxidized graphite, adding to deionized water and electrodepositing obtained solution on copper substrate.

LIU Y

Graphene-supported nano-nickel thermoelectric thin-film is obtained by preparing wave-absorbing material using e.g. surface-treated graphite oxide, mixing with water and depositing resultant on processed copper substrate.

LIU Y