国家/地区
IPC部 B（2）
IPC大类 B23（2）
IPC小类
IPC
发明人
公开年 2023（2）
申请年 2021（2）
专利权人

Solder composition used in solder joints of printed circuit boards, comprises a compound layer comprising an alloy of bismuth and tin, and a graphene coating positioned on the compound layer.

AURONGZEB D M

Powder useful for producing polycrystalline diamond sintered body, comprises metal-doped carbon-based powder containing metal in space between carbon atoms of carbon powder, and diamond powder.

KYOUNGRYOULHAN, LEE H S, YOUNG A S, JANG D