国家/地区 中国（19）
IPC部 B（19）
IPC大类 C25（19） B82（6） C01（5）
B22（4） C09（4） H01（4）
B01（3） C22（3） C23（3）
B21（2） B29（2） B32（2）
F28（2） H05（2）
IPC小类 C25D（19）
IPC C25D003/38（19）
发明人 CHEN W（3） JO T（2） JO T J（2）
KIDEOK S（2） LEE S（2） LEE S H（2）
LIU S（2） PARK S（2） SEULKI P（2）
SONG K（2） SONG K D（2） SUNHYOUNG L（2）
TAE J J（2） WANG Q（2） ZHANG Q（2）
公开年 2022（6） 2021（4） 2020（3） 2017（2） 2019（2）
申请年 2020（4）  2021（4）  2022（4）  2019（3）  2017（2） 
专利权人 GUANGZHOU KA.（2） ILJIN MATERI.（2） SHANDONG XIT.（2）

Ultra-thin low-resistance conductive polymer film, obtained by blending polymer, conductive substances and auxiliary agent to form blend, extruding and stretching into film and electroplating via copper sulfate solution to further grow copper on film.

ZHAO W, REN J, LI G, HU Y, JIANG Y, MA Y, ZHI L

Composite current collector for use in lithium battery field, has electroplating copper layer arranged on two sides of conductive polymer substrate layer, where conductive polymer substrate layer is provided conductive material and polymer substrate.

JIAO X, WANG R, LIU Z, YAN C

Preparation of copper-tungsten graphene-containing composite material for vacuum switch electric appliance, involves preparing tungsten-copper-graphene core-shell powder, and sintering obtained graphene core shell powder.

DING Y, ZHU Z, LIANG S, ZOU J, XIAO P, CHEN Z, ZHANG Q, DENG N

Manufacturing titanium fiber used in e.g. biomedical field, comprises subjecting titanium wire to acid washing, pre-nickel plating, and surface copper plating to obtain copper-plated titanium wire, compounding dried copper-plated titanium wire bundled iron pipe, and spraying modified alumina agent.

OUYANG Q, SHUAI G, WEI S, WU X

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J

Preparing copper-chromium-zirconium alloy layered belt material with composite deformation of graphene/copper, involves subjecting bulk copper-chromium-zirconium alloy to solid solution treatment, carrying out room temperature iso-channel extruding, low temperature rolling, stacking and vacuum-aging.

WANG D, AN X, DU Q, WEI K, YAO L, WEI W

Layered composite material used as heat conducting material comprises graphene layer and metal copper layer.

HU W, DENG Y, QIN Z, CHEN J, WU Z

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Electronic component three-dimensional (3D) printing device based on selective electro-deposition comprises x-axis moving device, y-axis moving device, and z-axis moving device which are all mounted on mounting support.

WU W, WANG J, GUO J, LIU T, ZHAO J

Composite material comprises copper matrix and graphene and carbon nanotubes oriented distributed in the copper matrix.

YANG M, LI T, LIU W, WANG Y, HOU H